𝔖 Bobbio Scriptorium
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Aluminum wire as a viable alternative to gold for ball bonding : G. McGill, M. Weilerstein, R. Venkatesh and J. Keverian. Semiconductor Int. 92 (August 1983)


Book ID
103278281
Publisher
Elsevier Science
Year
1984
Tongue
English
Weight
114 KB
Volume
24
Category
Article
ISSN
0026-2714

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