Alternative fabrication process for edgeless detectors on 6 in. wafers

3D processing on 6 in. high resisti

3D processing on 6 in. high resistive SOI wafers: Fabrication of edgeless strip and pixel detectors

✍ Simo Eränen; Juha Kalliopuska; Risto Orava; Nick van Remortel; Tuula Virolainen 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 506 KB

An insight is given into the state-of-the-art 3D processing on 6 in. (150 mm) high resistivity siliconon-insulator (SOI) wafers. The edgeless detector design offers some attractive properties for high-energy physics experiments and medical imaging studies, such as seamless tileability of the detecto

Alternative fabrication process for edgeless detectors on 6&#xa0;in. wafers

Alternative fabrication process for edgeless detectors on 6 in. wafers