Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps

✍ Scribed by Gordon, Michael S.; Rodbell, Kenneth P.; Heidel, David F.; Murray, Conal E.; Tang, Henry H. K.; Dwyer-McNally, Brendan; Warburton, William K.

• Book ID: 119950456
• Publisher: IEEE
• Year: 2010
• Tongue: English
• Weight: 252 KB
• Category: Article
• ISSN: 0018-9499
• DOI: 10.1109/TNS.2010.2085015