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Alloy Formation in Nanostructured Silicon

✍ Scribed by B. Gao; S. Sinha; L. Fleming; O. Zhou

Publisher
John Wiley and Sons
Year
2001
Tongue
English
Weight
216 KB
Volume
13
Category
Article
ISSN
0935-9648

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Creep tests are being carried out on ultra-fine grained (UFG) Al 5083 alloy processed by consolidating nanocrystalline cryomilled powder particulates in the temperature range of 573-648 K. The creep data show that the apparent stress exponent and the apparent activation energy increase continuously