Reviews
and the bazic physical characteristica of deposits. Theee chapters al1 provide good introductionz to their respective fields together with copieus references.
The next section entitled Techniquea comprises, in essence, the aforementioned "Vapor Plating." It providea a very convenient substance by substance ooverage of the many metals, boridea, carbides, nitriden, oxides, and silicidea for which vapor deposition methods are applicable.
The 6nal section, AppEiwiione, covers such diverse topics ae high purity metals, nudear fuels, protective coatings, pigments, and electronic applications. These are, in effect, review artioles and are more specialized in scope than the earlier part of the book.
In prepsring this book the editors have endeavored to avoid any unnecesaary or artifioial diiinction between physicsl and chemical vapor deposition, and as this appliea to the Fundamentals section, it is undoubtedly the correct policy. It is also deshable tor these interested in a particular substance to be able to find out if physical vapor deposition is applicable to that substance.
However, readers should be warned that insofar as this book covers vacuum deposition techniquee, it doas so mainly for completenees. The chapters on Phyeical Vapor Deposition, Optica1 Coatings, and Decorative Coatings more properly lie in the field of "thin films" and the seriously intereated reader will want to seek guidance from books devoted spe&cally to the topics of evaporation and sputterlng (such aa L. Hotind's book by the same publisher).
In the field of chemical vapor deposition, however, thii book is unrivaled.