Advances in wire bonding technology for high lead count, high-density devices : Guatam N. Shah, Lee R. Levine and Dipak I. Patel. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-11, 233 (1988)

• Book ID: 103284992
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 120 KB
• Volume: 29
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(89)90106-6