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Advances in Multifunctional Materials and Systems II (Ceramic Transactions, Volume 245) || Formation of Tough Foundation Layer for Electrical Plating on Insulator using Aerosol Deposition Method of Cu-Al 2 O 3 Mixed Powder

✍ Scribed by Akedo, Jun; Tseng, Tseung-Yuen; Chen, Xiang Ming; Lin, Hua-Tay


Book ID
121810758
Publisher
John Wiley & Sons, Inc.
Year
2014
Tongue
English
Weight
366 KB
Edition
1
Category
Article
ISBN
1118771273

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