Advanced Thermal Management Materials

✍ Scribed by Guosheng Jiang, Liyong Diao, Ken Kuang (auth.)

Publisher: Springer-Verlag New York
Year: 2013
Tongue: English
Leaves: 162
Edition: 1
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

✦ Table of Contents

Front Matter....Pages i-xi
Introduction to Thermal Management in Microelectronics Packaging....Pages 1-10
Requirements of Thermal Management Materials....Pages 11-28
Overview of Traditional Thermal Management Materials....Pages 29-44
Development of Advanced Thermal Management Materials....Pages 45-71
Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies....Pages 73-87
Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications....Pages 89-98
Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications....Pages 99-107
AlSiC Thermal Management Materials....Pages 109-122
Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper....Pages 123-140
Future Trend of Advanced Thermal Management Materials....Pages 141-149
Back Matter....Pages 151-154

✦ Subjects

Energy Efficiency (incl. Buildings); Electronics and Microelectronics, Instrumentation; Engineering Thermodynamics, Heat and Mass Transfer; Metallic Materials

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