Advanced simulation of die wear caused by wire vibrations during wire-drawing process

✍ Scribed by Kyung-Hun LEE; Sang-Kon LEE; Byung-Min KIM

• Book ID: 119580021
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 687 KB
• Volume: 22
• Category: Article
• ISSN: 1003-6326
• DOI: 10.1016/s1003-6326(11)61379-4