Advanced MEMS/NEMS Fabrication and Sensors
â Scribed by Zhuoqing Yang
- Publisher
- Springer
- Year
- 2021
- Tongue
- English
- Leaves
- 312
- Category
- Library
No coin nor oath required. For personal study only.
⌠Synopsis
⌠Table of Contents
Contents
Chapter 1: Tip-Based Nanofabrication for NEMS Devices
1.1 Introduction to NEMS
1.2 NEMS Fabrication Methods
1.3 Tip-Based Nanofabrication for NEMS Device
1.3.1 Thermal Dip-Pen Nanolithography
1.3.2 ThermalâChemical Decompositions
1.3.3 Electrochemical SPL
1.4 Future Trends and Conclusions
References
Chapter 2: Dimensional-Nanopatterned Piezoresistive Silicon Microcantilever for Environmental Sensing
2.1 Introduction
2.2 Mechanism of Operation
2.3 Basics of Microcantilevers
2.3.1 Resonance Frequency (fn)
2.3.2 Quality Factor
2.3.3 Figure of Merit of Microcantilever-Based Gas Sensors
2.3.3.1 Sensitivity
2.3.3.2 Limit of Detection (LOD)
2.3.3.3 Selectivity
2.3.4 Readout of the Microcantilever
2.3.5 Online Frequency Tracking
2.4 Fabrication of Si Microcantilever-Based Resonators
2.4.1 Fabrication of Microcantilever Structure
2.4.2 Nanostructuration of Microcantilevers Using Bottom-Up Method
2.4.3 Nanostructuration of Microcantilevers Using Top-Down Method
2.4.3.1 Nanoimprint Lithography
2.4.3.2 Nanosphere Lithography
2.4.3.3 Electron-Beam Lithography (EBL)
2.5 Environmental Sensing Applications
2.6 Conclusion and Future Trends
References
Chapter 3: Micromachining Based on Mask-Free Direct Writing: An Advanced Approach to Innovative MEMS Gas Sensors
3.1 Introduction
3.2 Inkjet Printing for the Fabrication of Advanced MEMS Gas Sensor
3.2.1 Functional Materials Constructing and Patterning by In Situ Inkjet Printing
3.2.2 Application of Inkjet Printing in the Fabrication of Catalytic MEMS Methane Sensor
3.2.2.1 Principle and Method
3.2.2.2 Device Fabrication
3.2.2.3 Characterization and Results
3.3 FsLDW for the Fabrication of Advanced MEMS Gas Sensor
3.3.1 Micro/Nano-Three-Dimensional Molding by FsLDW
3.3.2 Application of FsLDW in the Fabrication of MEMS Gas Sensors
3.3.2.1 Ceramics-Based Solid NO2 Sensor Performance Improved by Laser Removal
Principle and Method
Device Fabrication
Characterization and Results
3.3.2.2 Graphene-Based Flexible Humidity Sensor Fabricated by Laser Modification
Principle and Method
Device Fabrication
Characterization and Results
3.3.2.3 PEG-DA-Based Humidity Sensor Fabricated by Two-Photon Polymerization
Principle and Method
Device Fabrication
Characterization and Results
3.4 Concluding Remarks
References
Chapter 4: Composite Micro-Machining Technology on the Non-Silicon MEMS
4.1 Introduction
4.2 Materials and Fabrications
4.2.1 Bulk Micro-Machining on Non-silicon Materials
4.2.2 Surface Micro-Machining on Non-silicon Materials
4.2.3 Composite Micro-Machining on Non-silicon Materials
4.2.4 Diversified Materials
4.3 Non-silicon MEMS Device
4.3.1 MEMS with Complicated Movable Structures: Inertial Micro-Actuator
4.3.2 MEMS with Diversified Structures: Vibration-Based Energy Harvester
4.3.2.1 Broadening the Operating Bandwidth
4.3.2.2 Reducing the Resonant Frequency
4.3.3 MEMS with Diversified Functional Materials: Microchannel Heat Sink
4.3.4 MEMS with Diversified Fabrication Processes: High-Temperature Sensor
4.4 Test Methods for the Non-silicon MEMS Device
4.4.1 Material Properties
4.4.2 Output Performance and Structural Feature of MEMS
4.5 Conclusions
References
Chapter 5: Nano-in-Nano Integration Technology for Advanced Fabrication of Functional Nanofluidic Devices
5.1 Introduction
5.2 Fabrication of Nano-in-Nano Integration
5.2.1 Focus Ion Beam Milling for Mono-Material Nano-in-Nano Integration
5.2.2 Multiple Electron Beam Lithography for Metallic Nano-in-Nano Integration
5.3 Nano-in-Nano Integration for Functional Nanofluidic Devices
5.3.1 Nano-in-Nano Integration for High-Throughput Molecule Capture Arrays
5.3.2 Nano-in-Nano Integration for Active Nanovalve
5.3.3 Nano-in-Nano Integration for In Situ Nanosensing
5.4 Supporting Technologies for Nano-in-Nano Integrated Nanofluidic Devices
5.4.1 Low-Temperature Bonding for Nano-in-Nano Devices
5.4.2 Regeneration of Nano-in-Nano Devices
5.5 Conclusion and Outlooks
References
Chapter 6: NEMS Sensors Based on Novel Nanomaterials
6.1 Introduction to NEMS Sensors
6.2 Silicon Nanowires in NEMS-Based Sensing
6.2.1 Introduction to Silicon Nanowires
6.2.2 Advantages of Silicon Nanowires
6.2.3 Fabrication and Measurement
6.2.3.1 Fabrication
6.2.3.2 Measurement Principles
6.2.4 Sensing Applications
6.2.4.1 Physical Sensing
6.2.4.2 Gas Sensing
6.2.4.3 Chemical Sensing
6.2.4.4 Biomolecule Sensing
6.3 Carbon Nanotubes in NEMS-Based Sensing
6.3.1 Introduction to Carbon Nanotube (CNT)
6.3.2 Advantage of Carbon Nanotube
6.3.3 Fabrication and Measurement
6.3.4 Sensing Application
6.3.4.1 Physical Sensing
6.3.4.2 Gas Sensing
6.3.4.3 Chemical Sensing
6.3.4.4 Biomolecule Sensing
6.4 2D Materials in NEMS-Based Sensing
6.4.1 Introduction to 2D Materials
6.4.2 Advantages of 2D Materials
6.4.3 Fabrication/Measurement
6.4.3.1 Optical Detection
6.4.3.2 Electrical Detection
6.4.4 Sensing Applications
6.4.4.1 Physical Sensing
6.4.4.2 Gas Sensing
6.4.4.3 Chemical and Biomolecule Sensing
6.5 Piezoelectrics in NEMS-Based Sensing
6.5.1 Introduction to Piezoelectric Materials
6.5.2 Advantages of Piezoelectric Materials
6.5.3 Fabrication/Measurement
6.5.3.1 Detection Techniques
6.5.4 Sensing Applications
6.5.4.1 Physical Sensing
6.5.4.2 Gas Sensing
6.5.4.3 Chemical Sensing
6.5.4.4 Biomolecule Sensing
6.6 Concluding Remarks
References
Chapter 7: Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing
7.1 Introduction
7.2 Eutectic Hermetic Bonding for the Wafer-Level MEMS Packaging
7.2.1 Au-Sn Eutectic Bonding
7.2.2 Au-In Eutectic Bonding
7.2.3 In-Ag Eutectic Bonding
7.2.4 In-Sn Eutectic Bonding
7.3 Low-Temperature Wafer Direct Bonding
7.3.1 Wet Chemical Activated Bonding
7.3.2 Anodic Bonding
7.3.3 Ultraviolet (UV) Activated Bonding
7.3.4 Low-Temperature Plasma Activated Bonding
7.4 Room-Temperature Wafer Bonding
7.4.1 Surface Activated Bonding (SAB)
7.4.2 Modified SAB
7.4.3 Fluorine-Contained Plasma Activated Bonding
7.4.4 Au Intermediate-Layer Bonding
7.5 Application of Wafer Bonding in Plasmonics-Enhanced Micro/Nanofluidic Sensors
7.6 Summary and Outlook
References
Chapter 8: MOEMS-Enabled Miniaturized Biomedical Sensing and Imaging System
8.1 Introduction
8.2 Emerging MOEMS Technology for Miniaturization
8.3 Optical Coherence Tomography System Based on MOEMS
8.4 Photoacoustic Endomicroscopy
8.5 Confocal Endomicroscopy
8.6 Multiphoton System Based on MOEMS Techniques
8.7 Conclusion and Future Direction
References
Chapter 9: Bio-Inspired Flexible Sensors for Flow Field Detection
9.1 Introduction
9.2 Bio-Inspired Flexible Sensors for Hydrodynamic Detection
9.2.1 Fish Lateral Line
9.2.2 Flexible Artificial Lateral Line Sensors
9.3 Bio-Inspired Flexible Sensors for Aerodynamic Detection
9.3.1 Biological Hair Receptors
9.3.2 Flexible Artificial Hair-like Sensors
9.4 Concluding Remarks
References
Chapter 10: Optofluidic Devices for Bioanalytical Applications
10.1 Introduction
10.2 Fundamentals on Micro-Optics
10.3 Optofluidic Components and Integrated Systems
10.3.1 Optofluidic Light Source
10.3.2 Optofluidic Prism
10.3.3 Optofluidic Switch
10.3.4 Optofluidic Waveguide
10.3.5 Optofluidic Lens
10.3.6 Integrated Optical Detector
10.4 Fabrication Technologies of Optofluidic Components
10.4.1 Microfluidics Technologies
10.4.2 Micro-Optics Technologies
10.4.2.1 Technologies for Waveguide Fabrication
10.4.2.2 Technologies for Microlens Fabrication
10.5 Optofluidic Devices for Bioanalytical Application
10.5.1 Cytometry and Cell Biology Studies
10.5.2 Nucleic Acid and Protein Detection
10.6 Concluding Remarks
References
Chapter 11: Wearable MEMS Sensor Nodes for Animal Health Monitoring System
11.1 Introduction
11.2 Chicken Health Monitoring System
11.2.1 Event-Driven Measurement System for Low Power Consumption
11.2.2 PZT MEMS Switch Version Sensor Node
11.2.2.1 Fabrication of PZT MEMS Switch
11.2.2.2 Procedure for Implementing PZT MEMS Switches on Wireless Sensor Node
11.2.2.3 Experimental Procedure
11.2.2.4 Successful Result and Failure
11.2.3 PVDF Film Switch Version Sensor Node
11.2.3.1 Design and Fabrication of PVDF Film Version Sensor Node
11.2.3.2 Experimental Procedure
11.2.3.3 Measurement Result
11.3 Cow Health Monitoring
11.3.1 First-Cowâs-Tail Sensor Node
11.3.1.1 Design of Compact Wireless Sensor Nodes
11.3.1.2 Experimental Procedure
11.3.1.3 Measurement Result
11.3.2 Second- and Third-Cowâs-Tail Sensor Nodes
11.3.2.1 Design of Wireless Sensor Nodes with Separate Temperature Unit
11.3.2.2 Experimental Procedure
11.3.2.3 Measurement Result and the Number of the Operating Days
11.3.2.4 Design of Third-Cowâs-Tail Sensor Nodes
11.3.3 Cow Coat Sensor Nodes
11.3.3.1 Design of Cow Cote Sensor Nodes
11.3.3.2 Experimental Procedure
11.3.3.3 Measurement Result
11.4 Application to Giraffes
11.5 Concluding Remarks
References
Index
đ SIMILAR VOLUMES
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Togethe
<P>The book ?Smart Sensors and MEMS? provides an unique collection of contributions on latest achievements in sensors area and technologies that have made by eleven internationally recognized leading experts from Czech Republic, Germany, Italy, Israel, Portugal, Switzerland, Ukraine and USA during t
The book Smart Sensors and MEMS provides an unique collection of contributions on latest achievements in sensors area and technologies that have made by eleven internationally recognized leading experts from Czech Republic, Germany, Italy, Israel, Portugal, Switzerland, Ukraine and USA during the NA
The book Smart Sensors and MEMS provides an unique collection of contributions on latest achievements in sensors area and technologies that have made by eleven internationally recognized leading experts from Czech Republic, Germany, Italy, Israel, Portugal, Switzerland, Ukraine and USA during the NA
<p><P>The book <STRONG>Smart Sensors and MEMS</STRONG> provides an unique collection of contributions on latest achievements in sensors area and technologies that have made by eleven internationally recognized leading experts from Czech Republic, Germany, Italy, Israel, Portugal, Switzerland, Ukrain