Advanced Materials for Printed Flexible Electronics (Springer Series in Materials Science, 317)

✍ Scribed by Colin Tong

• Publisher: Springer
• Year: 2021
• Tongue: English
• Leaves: 641
• Edition: 1st ed. 2022
• Category: Library

✦ Synopsis

This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.

✦ Table of Contents

Preface
Contents
About the Author
Chapter 1: Fundamentals and Design Guides for Printed Flexible Electronics
1.1 Historical Perspectives on Printed Flexible Electronics
1.2 Printing Requirements for Printable Materials
1.2.1 Ink Formulation
1.2.2 Inks for Flexible Devices
1.2.3 Inks for Stretchable Devices
1.2.4 Inks for Self-Healing Devices
1.2.5 Polymer Substrate Formulation
1.3 Design Guidelines for Printed Flexible Electronics
1.3.1 3D Modeling and Printing Process Control
1.3.2 Design Guideline for 3D Printing
1.3.3 Materials Design for Flexible and Stretchable Electronics
1.4 Fabrication Technology for 3D Printed Flexible Electronics
1.4.1 Nozzle-Based 3D Printing Technologies
1.4.2 Light-Based 3D Writing Technologies
1.4.2.1 Two-Photon Lithography
1.4.2.2 Projection Micro-stereolithography
1.4.2.3 Continuous Liquid Interface Production
1.4.3 Representative Multi-material and Hybrid 3D Printing Processes
1.4.4 Stress-Controlled Folding of 3D Systems
1.4.4.1 4D Printing
1.4.4.2 Micro- and Nanoscale Origami
1.4.5 Mechanically Guided Assembly
References
Chapter 2: Process and Material Characterization in Printed Flexible Electronics
2.1 Fluid Characterization
2.1.1 Rheology and Wetting Behavior
2.1.1.1 Viscosity
2.1.1.2 Surface Energies and Surface Tensions
2.1.1.3 Viscoelasticity
2.1.1.4 Direct Imaging
2.1.1.5 Dynamic Measurements
2.1.2 Jet Breakup and Drop Formation
2.1.3 Characteristics of Jet Fluids with Solid Fillers
2.1.3.1 Rheology of Particle Suspensions
2.1.3.2 Shear Thinning Fluids
2.1.3.3 Phase-Changing Inks and Three-Dimensional Printing
2.1.4 Ink Drop Impact and Reaction with Substrate
2.1.4.1 Drop Impact on Powder and Three-Dimensional Printed Structures
2.1.4.2 Drop Impact on Textile Surfaces
2.1.5 Solidification
2.1.6 Curing and Sintering
2.1.6.1 Thermal Sintering
2.1.6.2 Electrical Sintering
2.1.6.3 Photonic Sintering
2.1.6.4 Microwave Sintering
2.2 Solid Feedstock Materials Characterization Techniques
2.2.1 Filament for Fused Deposition
2.2.1.1 Filament Diameter Consistency
2.2.1.2 Density
2.2.1.3 Porosity
2.2.1.4 Moisture Content
2.2.1.5 Thermal Properties
2.2.1.6 Microstructure Analysis of Composite Filament
2.2.2 Powder for Additive Manufacturing Processes
2.2.2.1 Powder Morphology
2.2.2.1.1 Sieve Analysis
2.2.2.1.2 Microcopy Analysis
2.2.2.1.3 Laser Light Diffraction
2.2.2.1.4 Influence of Particle Size and Size Distribution on Part Properties
2.2.2.1.5 Effect of Particle Shape and Surface Roughness
2.2.2.2 Powder Chemistry
2.2.2.2.1 X-Ray Photoelectron Spectroscopy
2.2.2.2.2 Auger Electron Spectroscopy
2.2.2.2.3 Energy Dispersive X-Ray Spectroscopy
2.2.2.2.4 Inductively Coupled Plasma Optical Emission Spectroscopy
2.2.2.2.5 Inert Gas Fusion
2.2.2.2.6 Effect of Powder Chemistry
2.2.2.3 Powder Microstructure
2.2.2.3.1 Metallography
2.2.2.3.2 X-Ray Diffraction
2.2.2.3.3 Thermal Analysis Methods
2.3 Aerosol Jet Printing Process Characterization
2.3.1 Working Principle of Aerosol Jet Printing
2.3.1.1 Atomization Approach
2.3.1.2 Materials Transport, Focusing, and Deposition
2.3.2 Aerosol Jet Printing Parameters
2.3.2.1 Sheath and Atomizer Gas Flow
2.3.2.2 Tool Path and Design Rules
2.3.3 Future Aerosol Jet Printing Process Modification and Application
2.4 Printed Thin-Film Characterization
2.4.1 Optical Characterization
2.4.1.1 Optical Microscopy
2.4.1.2 UV-Vis Spectroscopy
2.4.2 Additional Surface Topography
2.4.2.1 Stylus Profilometry
2.4.2.2 Confocal and White-Light Microscopy
2.4.2.3 Atomic Force Microscopy
2.4.3 Electrical Conductivity Measurement
2.5 Mechanical Characterization of Printed Flexible Electronics
2.5.1 Determining Materials Constants
2.5.2 Bending Deformation
2.5.3 Stretching Deformation
2.5.4 Shear and Twisting Deformation
2.5.5 Adhesion, Cohesion, and Scratch Testing
2.5.6 Impact Resistance
2.6 Durability of Flexible Electronics
2.6.1 Engineering Stress Distribution Across Layers
2.6.2 Nanoribbons and Nanomembranes
2.6.3 Separation of Brittle Components
2.6.4 Future Perspectives
References
Chapter 3: Conductive Materials for Printed Flexible Electronics
3.1 Introduction
3.2 Advanced Metal-Based Materials for Micro/Nanoscale 3D Printing
3.2.1 Metal Nanoparticles
3.2.1.1 Synthesis of Metal Nanoparticles
3.2.1.2 Stabilization of Dispersed Metal Nanoparticles Against Aggregation
3.2.1.3 Stabilization of Metal Nanoparticles Against Oxidation
3.2.1.4 Formulation of Metal-Based Conductive Inks
3.2.1.5 Metal-Based Conductive Inks for Printing 3D Structures
3.2.2 Metal Nanowires
3.2.3 Liquid Metal Inks
3.2.4 Reactive Metal Inks
3.3 Carbon-Based Materials
3.3.1 Graphene-Based Inks
3.3.2 Carbon Nanotube-Based Inks
3.4 Transparent Oxide Conductors
3.5 Conductive Polymer Inks
3.6 Perspectives and Future Development Trends of Conductive Inks
3.6.1 Traditional Polymer Thick Film Inks
3.6.2 Printing Inks for In-Mold Electronics
3.6.3 Stretchable Conductive Inks
3.6.3.1 Sputtering/Etching or Laser-Cutting Conductive Films on Stretchable Substrates
3.6.3.2 Embedding Stretchable Conductive Materials in Stretchable Substrates
3.6.3.3 Thinning or Developing Meandering Patterns
3.6.3.3.1 Pre-strained Substrate Approach
3.6.3.3.2 Localized Node Bonding Approach
3.6.3.3.3 Helix Structure Approach
3.6.4 Enabling Limited Stretchability by Printing Conductive Ink on Stretchable Substrates
References
Chapter 4: Semiconducting Materials for Printed Flexible Electronics
4.1 Introduction
4.2 Flexible Inorganic Semiconducting Materials
4.2.1 Thin Films of Silicon
4.2.2 Films of Transparent Oxides
4.2.2.1 ZnO Films Deposited from the Gas Phase
4.2.2.2 ZnO Films Spin-Cast from Colloidal Solutions
4.2.2.3 Films of ZnO-Based Binary and Ternary Oxides
4.2.3 Films of Chalcogenides
4.2.3.1 Films of Chalcogenide Nanocrystals
4.2.3.2 Films of Chalcogenides Derived from Liquid Precursors
4.2.4 Nanoscale Inorganic Semiconductors Formed with Bottom-Up Approaches
4.2.5 Nanoscale Inorganic Semiconductors Formed with Top-Down Approaches
4.3 Organic Semiconductors for Flexible Electronics
4.3.1 Historical Perspective
4.3.2 Material Types
4.3.3 Basic Properties of Organic Semiconductors
4.3.3.1 Physical Properties
4.3.3.2 Optical Properties
4.3.3.3 Charge Carrier Transport
4.3.4 Architectures and Properties of Organic Semiconductor Devices
4.3.5 Organic Semiconductor Structural Design in Printed Electronics
4.4 Printable Organic Small Molecular Semiconductors
4.4.1 p-Type Small Molecular Semiconductors
4.4.2 n-Type Small Molecular Semiconductors
4.5 Printable Polymeric Semiconductors
4.5.1 p-Type Conjugated Polymer Semiconductors
4.5.2 n-Type Conjugated Polymers
4.5.3 Perspectives of Solution-Processed Polymer Semiconductors
4.6 Composite Organic Semiconductors
4.6.1 Polymer-Fullerene Bulk Heterojunctions
4.6.2 Polymer-Polymer Semiconductor Composites
4.6.3 Organic-Inorganic Composites of Semiconductor Nanocrystals
4.6.4 Nanoconfinement of Polymer Semiconductors with Improved Stretchability
References
Chapter 5: Substrate and Encapsulation Materials for Printed Flexible Electronics
5.1 Substrate Materials
5.1.1 General Requirements for Flexible Substrates
5.1.2 Types of Substrate Materials
5.1.2.1 Polymer Substrate Materials
5.1.2.2 Inorganic Substrate Materials
5.1.2.3 Fibrous Substrate Materials
5.2 Dielectric Materials
5.2.1 Inorganic Dielectrics
5.2.2 Polymer Dielectrics
5.2.2.1 Poly(vinyl alcohol)
5.2.2.2 Cyanoethyl Polymers
5.2.2.3 Poly(vinylidene fluoride) and Its Copolymers
5.2.3 Electrolyte Dielectrics
5.2.3.1 Polymer Electrolytes
5.2.3.2 Polyelectrolytes
5.2.3.3 Ionic Liquids
5.2.3.4 Ion-Gels
5.2.4 Hybrid Dielectrics
5.2.4.1 Self-Assembled Nano-dielectrics
5.2.4.2 Inorganic/Polymer Blends
5.3 Encapsulation
5.3.1 Encapsulation Evaluation Methods
5.3.2 Traditional Encapsulation Approaches
5.3.3 Chemical Vapor Deposition Technology for Encapsulation
5.3.4 Atomic Layer Deposition for Encapsulation
5.3.5 Thin Film Encapsulation for Flexible Devices
References
Chapter 6: Printed Flexible Thin-Film Transistors
6.1 Types of Transistors
6.1.1 Bipolar Junction Transistors
6.1.1.1 NPN Transistor
6.1.1.2 PNP Transistor
6.1.2 Field-Effect Transistors
6.1.2.1 Junction-Field-Effect Transistor
6.1.2.2 Metal-Oxide-Semiconductor Field-Effect-Transistor
6.1.3 Other Emerging Transistors
6.2 Structure and Operation of Thin-Film Transistors
6.3 Printing Techniques and Printed Components of Thin-Film Transistors
6.3.1 Printing Techniques
6.3.2 Printed TFTs on Rigid Substrate
6.3.2.1 Printed Semiconductor Layer
6.3.2.1.1 Organic Semiconductor
6.3.2.1.2 Carbon-Based Semiconductor
6.3.2.2 Printed Dielectric Layer
6.3.2.3 Printed Electrodes
6.3.2.4 Fully Printed TFTs
6.3.3 Printed TFTs on Flexible Substrate
6.3.3.1 Polymer Substrates
6.3.3.1.1 Partly Printed TFTs on Flexible Substrate
6.3.3.1.2 Fully Printed TFTs on Flexible Substrate
6.3.3.2 Paper Substrate
6.4 Printed Organic Thin-Film Transistors
6.4.1 Materials for OTFTs
6.4.1.1 Organic Semiconductors
6.4.1.2 Gate Dielectrics in OTFTs
6.4.1.3 Other Materials Used in OTFTs
6.4.2 Device Structures Used for OTFTs
6.4.3 Manufacturing Process and Integration of OTFTs
6.4.3.1 Processes Compatible with Established Industry Facilities
6.4.3.2 Full Printing Processes for OTFTs
6.4.3.3 Challenges and Outlook for OTFT Technologies
6.5 Printed Inorganic Thin-Film Transistors
6.5.1 Printed Oxide Transistors
6.5.1.1 Vacuum Deposition-Based Metal Oxide TFTs
6.5.1.2 Solution-Processed n-Type Metal-Oxide-Semiconductors
6.5.1.2.1 Basics of Sol–Gel Oxide Chemistry
6.5.1.2.2 Low-Temperature Route for Solution-Processed n-Type Oxide Semiconductors
Novel Precursor Approaches
Novel Posttreatment Methods
6.5.1.2.3 Current Challenges in Solution-Processed n-Type Oxide Semiconductors
6.5.1.3 Solution-Processed p-Type Metal-Oxide-Semiconductors
6.5.1.3.1 Basics of p-Type Oxide Semiconductors
6.5.1.3.2 Copper Oxide
6.5.1.3.3 Tin Monoxide
6.5.1.3.4 Nickel Oxide
6.5.1.3.5 Current Challenges in Solution-Processed p-Type Oxide Semiconductors
6.5.2 Carbon Nanotubes for Thin-Film Transistors
6.5.2.1 SWCNT-TFT Fabrication
6.5.2.1.1 CNT Fabrication
6.5.2.1.2 Separation of Metallic and Semiconducting CNTs
6.5.2.1.3 CNT Film Fabrication Process
6.5.2.1.4 SWCNT-TFT Structure and Fabrication Process
6.5.2.2 Electrical, Optical, and Mechanical Properties of SWCNT-TFTs
6.5.2.2.1 Electrical Properties
6.5.2.2.2 Optical Properties
6.5.2.2.3 Mechanical Properties
6.5.2.3 Outlook on Carbon Nanotubes-Based Thin-Film Transistors
6.5.2.3.1 Alignment
6.5.2.3.2 Metal Contact
6.5.2.3.3 Semiconducting CNT Purity
6.5.2.3.4 N-Type Device
6.5.2.3.5 Integration
6.5.3 Thin-Film Transistors Based on Graphene and Graphene/Semiconductor Heterojunctions
6.5.3.1 Graphene Acting as Channel Material in Thin-Film Transistors
6.5.3.2 Graphene Acting as Electrode Material in Thin-Film Transistors
6.5.3.2.1 Preparation of Graphene/Semiconductor Heterojunctions
Mechanical Stacking Method
Direct CVD Growth of 2D Nanomaterials Heterostructures
6.5.3.2.2 Graphene/Inorganic Semiconductor Heterojunction TFTs
6.5.3.2.3 Graphene/Organic Semiconductor Heterojunction TFTs
6.5.3.3 Outlook on Graphene-Based Thin-Film Transistors
6.5.4 High-Mobility Thin-Film Transistors Based on Multilayer 2D Materials
6.5.4.1 Rationale
6.5.4.2 Common 2D Materials for TFTs
6.5.4.3 Applications of 2D TMDs TFTs
6.5.4.3.1 Flexible Devices
6.5.4.3.2 Transparent Devices
6.5.4.3.3 Optoelectronic Devices: Sensitive Photodetectors
6.5.4.4 Outlook on High-Mobility Thin-Film Transistors
References
Chapter 7: Printed Flexible Organic Light-Emitting Diodes
7.1 Introduction
7.2 Working Principle of Organic Light-Emitting Diodes
7.2.1 Basic Light Phenomena
7.2.1.1 Incandescence
7.2.1.2 Luminescence
7.2.1.2.1 Photoluminescence
7.2.1.2.2 Electroluminescence
7.2.2 OLED Device Structure
7.2.3 OLED Working
7.2.4 OLED Classification
7.2.4.1 Passive-Matrix OLED (PMOLED)
7.2.4.2 Active-Matrix OLED (AMOLED)
7.2.4.3 Transparent OLEDs
7.2.4.4 Top- and Bottom-Emitting OLED
7.2.4.5 White OLEDS
7.2.4.6 Flexible OLED
7.2.4.7 Phosphorescent OLED
7.2.5 OLED Characterization
7.2.5.1 Internal Quantum Efficiency
7.2.5.2 External Quantum Efficiency
7.2.5.3 Outcoupling Efficiency
7.2.5.4 Efficacy
7.2.5.5 Lifetime Issues
7.2.5.6 Routine Testing for Performance Evaluation of OLED Device
7.2.6 OLED Fabrication Techniques
7.2.6.1 Physical Vapor Deposition
7.2.6.2 Screen Printing
7.2.6.3 Inkjet Printing
7.2.6.4 In-line Fabrication
7.2.6.5 Roll-to-Roll Process
7.3 General Materials and Components of OLEDs
7.3.1 Substrate
7.3.1.1 Geometric Properties: Hermiticity and Surface Roughness
7.3.1.2 Substrate Material Requirements
7.3.2 Anode
7.3.3 Cathode
7.3.4 Organic Emissive Materials
7.3.5 Amorphous Molecular Materials for Hole- and Electron-Transporting
7.3.5.1 Hole Transporting Amorphous Molecular Materials
7.3.5.2 Electron-Transporting Amorphous Molecular Materials
7.3.6 Solution-Processable OLED Materials
7.3.7 Encapsulation for OLEDs
7.4 White Lighting OLEDs
7.4.1 White Light Emission Mechanism
7.4.1.1 White Light Emission from Small-Molecule-Doped Polymer Films
7.4.1.1.1 Fluorescence-Emitting Dopants
7.4.1.1.2 Phosphorescent Emitters
7.4.1.1.3 Hybrid Fluorescent Blue/Phosphorescent Green and Red Systems
7.4.1.2 White Emission from Multiple Light-Emitting Polymers
7.4.1.2.1 Blended Polymeric Systems
7.4.1.2.2 White Light from Polymer Heterolayers
7.4.1.3 Single-Component Polymer Systems
7.4.1.3.1 Conjugated Copolymers Comprising Main Chain Chromophores
7.4.1.3.2 Copolymers with Side-Chain Chromophores
7.4.1.4 Outlook on the Development of Polymer White OLEDs
7.4.2 White OLEDs Based on Small Molecules
7.4.3 Light Outcoupling Improvement and Efficiency Limitation of White OLEDs
7.5 Flexible Quantum Dot Light-Emitting Diodes
7.5.1 Material Design for Efficient QLEDs
7.5.2 Device Structures and Operation Principles of QLEDs
7.5.3 Patterning Technology of QDs for Full-Color Displays
7.5.4 Flexible White QLEDs
7.5.5 Flexible Transparent QLEDs
7.5.6 Potential Applications of Flexible QLEDs
7.5.7 Outlook on Flexible and Wearable QLEDs
References
Chapter 8: Printable Solar Cells from Solution Processable Materials
8.1 Operating Principles of Printable Solar Cells
8.1.1 Fundamentals of Solar Cells
8.1.2 Device Structure
8.1.3 Operating Principles
8.1.4 Performance Characteristics
8.1.4.1 Fill Factor
8.1.4.2 Open Circuit Voltage
8.1.4.3 Short Circuit Current Density
8.1.4.4 Absorption Coefficient
8.1.4.5 Recombination and Diffusion Length
8.1.4.6 Photovoltaic Cell Efficiency Limit
8.2 Solution-Processed Organic Polymeric Solar Cells
8.2.1 Historical Perspective
8.2.2 Tandem Solar Cells
8.2.2.1 Interconnecting Layer Materials
8.2.2.2 Processing Multijnction Stacks and Light Management
8.2.2.3 Active Layer Materials
8.2.2.4 Upscaling
8.3 Solution-Processed Inorganic CIGS/CZTS Thin-Film Solar Cells
8.4 Organic–Inorganic Hybrid Perovskite Solar Cells
8.5 Outlook and Future Perspective
References
Chapter 9: Printed Flexible Electrochemical Energy Storage Devices
9.1 Perspectives on Electrochemical Energy Storage
9.1.1 Classification of Electrochemical Energy Storage
9.1.1.1 Basic Battery Operation
9.1.1.2 Basic Operation of Capacitor and Supercapacitor
9.1.2 Miniaturization of Electrochemical Energy Storage Devices for Flexible/Wearable Electronics
9.2 3D Printing for Electrochemical Energy Storage Applications
9.2.1 Printing Technologies for Electrochemical Energy Storage Device Fabrication
9.2.1.1 Basic 3D Printing Systems and Processes
9.2.1.2 Materials Considerations
9.2.2 Performance Optimization Strategies
9.2.2.1 Performance Metrics
9.2.2.2 Optimization Strategies
9.2.2.2.1 Utilization of Nanomaterials
9.2.2.2.2 Electrical Transport Optimization
9.2.2.2.3 Ionic Transport Optimization
9.2.2.2.4 Mechanically Robust Design
9.2.2.2.5 Scaling Up Performance Optimization
9.2.3 Advances in 3D-Printed Electrochemical Energy Storage Devices
9.2.3.1 Sandwich-Type Configurations
9.2.3.1.1 Sandwich-Type Batteries
9.2.3.1.2 Sandwich-Type Electrochemical Capacitors
9.2.3.2 In-Plane Configurations
9.2.3.2.1 In-Plane Batteries
9.2.3.2.2 In-Plane Electrochemical Capacitors
9.2.4 Outlook on Printed Electrochemical Energy Storage Devices
9.3 Printed Battery Architectures
9.3.1 Printing Technique Adoption
9.3.2 Preparation of Battery Component Inks
9.3.2.1 Printed Electrodes
9.3.2.2 Printed Electrolytes and Separator Membranes
9.3.3 Electrochemical Performances of Printed Batteries
9.3.4 Advances in Printed Battery Systems and Their Applications
9.3.4.1 Zn-Based Batteries
9.3.4.2 Li-Ion Batteries
9.3.5 Perspectives and Future Development Directions
9.4 Printed Flexible Supercapacitors
9.4.1 Device Structures of Printed Supercapacitors
9.4.2 Printable Materials for Supercapacitors
9.4.2.1 Electrode Materials
9.4.2.1.1 Carbon-Based Electrode Materials
9.4.2.1.2 Metal-Based Electrode Materials
9.4.2.1.3 Conducting Polymers
9.4.2.1.4 2D Nanomaterials Beyond Graphene
9.4.2.1.5 Metal-Organic Frameworks
9.4.2.2 Electrolytes
9.4.2.2.1 Aqueous Gel Polymer Electrolytes
9.4.2.2.2 Organic Gel Polymer Electrolytes
9.4.2.2.3 Ionic Liquid-Based Gel Polymer Electrolytes
9.4.2.2.4 Redox-Active Gel Electrolytes
9.4.2.3 Current Collectors
9.4.2.3.1 Metal Current Collectors
9.4.2.3.2 Carbon-Based Current Collectors
9.4.2.4 Substrates
9.4.2.4.1 Metal Foils
9.4.2.4.2 Polymer-Based Plastic Substrates
9.4.2.4.3 Paper Substrates
9.4.2.4.4 Textiles
9.4.3 Advances of Printed Supercapacitors
9.4.3.1 Inkjet Printing
9.4.3.2 Screen Printing
9.4.3.3 Three-Dimensional (3D) Printing
9.4.3.4 Transfer Printing
9.4.3.5 Pen-Based Direct Ink Writing
9.4.3.6 Roll-to-Roll (R2R) Printing
9.4.3.7 Patterned Coating Methods
9.4.3.8 Outlook on Printed Supercapacitors
9.4.4 Applications of Printed Supercapacitors
9.4.4.1 Multifunctional Supercapacitors
9.4.4.2 Supercapacitors Working as Power Units for Sensors
9.4.4.3 Supercapacitors Working as Energy Storage Units for Ambient Energy Sources
9.4.5 Challenges and Future Perspectives
References
Chapter 10: Printed Flexible Sensors and Sensing Systems
10.1 Introduction
10.2 Working Principle of Sensors
10.3 Printable Materials and Component Integration
10.3.1 Substrates for Flexible Sensors
10.3.2 Conducting Materials
10.3.2.1 Metals
10.3.2.2 Amorphous Oxide Conductors
10.3.2.3 Carbon Conductors
10.3.2.4 Organic Conductors
10.3.3 Semiconductors
10.3.3.1 Metal Oxide Semiconductors
10.3.3.2 Organic Semiconductors
10.3.3.3 Flexible Silicon
10.3.3.4 Transition Metal Dichalcogenides
10.3.3.5 Black Phosphorus
10.3.3.6 Perovskites
10.3.4 Dielectric Materials
10.4 Printed Flexible Sensors
10.4.1 Printable Pressure Sensors
10.4.1.1 Piezoresistive Sensors
10.4.1.2 Piezoelectric Sensors
10.4.1.3 Piezocapacitive Sensors
10.4.1.4 Triboelectric Sensors
10.4.2 Printable Strain Sensors
10.4.3 Temperature Sensors
10.4.4 Humidity Sensors
10.4.5 Magnetic Sensors
10.4.6 Chemical Sensors
10.4.7 Electromagnetic Radiation Sensors
10.4.8 Multimodal Sensors
10.4.9 Electropotential Sensors
10.4.10 Ultrasonic Sensors
10.5 Integration of Printed Sensors into Systems
10.6 Future Perspectives
References
Chapter 11: Printed Flexible Hybrid Electronics
11.1 State-of-the-Art Development
11.1.1 The Roles of Printed Electronics and Standard Silicon Integrated Circuits
11.1.2 The Merit of Flexible Hybrid Electronics
11.2 Core Components of the Flexible Hybrid Electronics
11.2.1 Substrate
11.2.2 Inks and Printing Techniques
11.2.3 Printed Sensors and Circuits
11.3 Thinned Silicon ICs and Assembly Process in FHE
11.3.1 Thinning Silicon ICs and Connecting to FHE
11.3.2 Conductive and Nonconductive Adhesives
11.3.3 Assembly Process for Rigid Components in FHE
11.4 Printed Antennas for Wireless Power and Communications
11.4.1 Printed Antennas for Communication Purposes
11.4.2 Printed Coils for Wireless Power Transfer
11.5 Printed Power Sources: Batteries, Solar Cells, and Energy Harvesters
11.5.1 Printed Energy-Storage Modules
11.5.2 Printed Energy-Harvesting Modules
11.6 Quality Assurance
11.6.1 High-Resolution Patterning
11.6.2 Uniformity
11.6.3 Flexibility/Stretchability
11.6.4 Durability
11.7 Reliability Evaluation
11.8 Application
11.8.1 Wearable Health Monitoring with FHE
11.8.2 Industrial, Environmental, and Agricultural Monitoring with FHE
11.8.3 Structural Health Monitoring with FHE
11.9 Challenges and Future Trends
References
Chapter 12: Current Trends and Prospects in Advanced Manufacturing for Printed Electronics
12.1 Introduction
12.2 Electronic Materials and Components
12.3 Techniques and Processes in Printed Electronics
12.3.1 Techniques in Printed Electronics
12.3.1.1 2D-Printing Technologies
12.3.1.2 3D-Printing Technologies
12.3.1.3 4D-Printing Technologies
12.3.2 Processes in 3D-Printing Electronics
12.4 Current Trends in 3D-Printed Electronics
12.4.1 Research and Development
12.4.1.1 Common Devices
12.4.1.2 Antennas
12.4.1.3 Flexible Electronics
12.4.1.4 Batteries
12.4.2 Integrated 3D-Printing Systems for Mass Production
References
Abbreviations
Index