Advanced Interconnects for ULSI Technology (Baklanov/Advanced Interconnects for ULSI Technology) || Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

✍ Scribed by Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried

• Book ID: 120215686
• Publisher: John Wiley & Sons, Ltd
• Year: 2012
• Weight: 695 KB
• Category: Article
• ISBN: 0470662549
• DOI: 10.1002/9781119963677.ch9