Adhesives Technology for Electronic Applications. Materials, Processes, Reliability

✍ Scribed by James J. Licari and Dale W. Swanson (Auth.)

Publisher: William Andrew
Year: 2005
Tongue: English
Leaves: 463
Series: Materials and processes for electronic applications series
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley

Content:
Preface, Pages vii-viii
Acknowledgements, Pages ix-x
1 - Introduction, Pages 1-37
2 - Functions and Theory of Adhesives, Pages 39-94
3 - Chemistry, Formulation, and Properties of Adhesives, Pages 95-168
4 - Adhesive Bonding Processes, Pages 169-260
5 - Applications, Pages 261-346
6 - Reliability, Pages 347-391
7 - Test and Inspection Methods, Pages 393-430
Appendix, Pages 431-439
Index, Pages 441-457

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