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Adhesion of suspension particles on the wall surface of the container

โœ Scribed by Uno, H. ;Tanaka, S.


Book ID
105219541
Publisher
Springer-Verlag
Year
1971
Weight
533 KB
Volume
245
Category
Article
ISSN
0023-2904

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Simulation of the Adhesion of Particles
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The removal of micrometer and submicrometer particles from dielectric and metal films represents a challenge in postchemical mechanical polishing cleaning. Proper modeling of the adhesive force between contaminant particles and these films is needed to develop optimal solutions to postchemical mecha