Adhesion of poly(4,4′-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin

Miscibility of polyimide with polymeric

Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: Effect of precursor origin

✍ J. Yu; M. Ree; T. J. Shin; X. Wang; W. Cai; D. Zhou; K.-W. Lee 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 176 KB 👁 2 views

Poly(amic acid) (PAA) and poly(amic diethyl ester) (PAE) precursors of poly(4,4Ј-oxydiphenylene biphenyltetracarboximide) (BPDA-ODA PI) were synthesized. Miscibility behaviors of these precursors with poly(arylene ether benzimidazole) (PAEBI), which is a good adhesion primer for copper metal, were i