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Adhesion enhancement of ink-jet printed conductive copper patterns on a flexible substrate

✍ Scribed by Lee, Young-In; Choa, Yong-Ho

Book ID
120456796
Publisher
Royal Society of Chemistry
Year
2012
Tongue
English
Weight
668 KB
Volume
22
Category
Article
ISSN
0959-9428

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Ink-jet printing of Cu conductive ink on
Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment
✍ Yong-Sung Goo; Young-In Lee; Namwoo Kim; Kun-Jae Lee; Bongyoung Yoo; Sung-Jei Ho πŸ“‚ Article πŸ“… 2010 πŸ› Elsevier Science 🌐 English βš– 524 KB

We conducted ink-jet printing of copper (Cu) conductive ink on polyimide (PI) film to form Cu conductive patterns and determine the correlation between Cu ink based on Cu complex and flexible substrate. First, the oxygen plasma treatment was performed to modify the surface property of the PI film, a