✦ LIBER ✦
Adhesion-enhanced thick copper film deposition on aluminum oxide by an Ion-beam-mixed Al seed layer
✍ Scribed by Hyung-Jin Kim, Jae-Won Park
- Book ID
- 119937152
- Publisher
- The Korean Physical Society
- Year
- 2012
- Tongue
- English
- Weight
- 372 KB
- Volume
- 61
- Category
- Article
- ISSN
- 0374-4884
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