✦ LIBER ✦
Addressing the challenges in solder resistance measurement for electromigration test
✍ Scribed by Y.C. Tan; C.M. Tan; T.C. Ng
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 193 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0026-2714
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