Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

✍ Scribed by S. Y. Chang; L. C. Tsao; M. J. Chiang; T. H. Chuang; C. N. Tung; G. H. Pan

• Book ID: 111786208
• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 686 KB
• Volume: 12
• Category: Article
• ISSN: 1059-9495
• DOI: 10.1361/105994903770342890