✦ LIBER ✦
Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals
✍ Scribed by Okoro, Chukwudi; Kabos, Pavel; Obrzut, Jan; Hummler, Klaus; Obeng, Yaw S.
- Book ID
- 124150286
- Publisher
- IEEE
- Year
- 2013
- Tongue
- English
- Weight
- 984 KB
- Volume
- 60
- Category
- Article
- ISSN
- 0018-9383
No coin nor oath required. For personal study only.