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Abrasive properties of nano silica particles prepared by a sol–gel method for polishing silicon wafers

✍ Scribed by Kazuaki Yoshida

Publisher: Springer
Year: 2007
Tongue: English
Weight: 195 KB
Volume: 43
Category: Article
ISSN: 0928-0707
DOI: 10.1007/s10971-007-1567-1

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