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A wafer-level package of wideband microwave transmission system based on BCB/metal structure embedded in Si substrate

✍ Scribed by Wang, Tianxi; Tang, Jiajie; Luo, Le


Book ID
120587540
Publisher
Springer-Verlag
Year
2013
Tongue
English
Weight
612 KB
Volume
19
Category
Article
ISSN
0946-7076

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