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A VLSI bipolar metallization design with three-level wiring and area array solder connections : L. J. Fried, J. Havas, J. S. Lechaton, J. S. Logan, G. Paal and P. A. Totta. IBM Jl Res. Dev.26 (3), 362 (1982)


Publisher
Elsevier Science
Year
1983
Tongue
English
Weight
114 KB
Volume
23
Category
Article
ISSN
0026-2714

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