A three-layer 3D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks

✍ Scribed by Bond, S.W.; Vendier, O.; Lee, M.; Jung, S.; Vrazel, M.; Lopez-Lagunas, A.; Chai, S.; Dagnall, G.; Brooke, M.; Jokerst, N.M.; Wills, D.S.; Brown, A.

• Book ID: 117866265
• Publisher: IEEE
• Year: 1999
• Tongue: English
• Weight: 671 KB
• Volume: 5
• Category: Article
• ISSN: 1077-260X
• DOI: 10.1109/2944.778306