✦ LIBER ✦
A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling
✍ Scribed by A. Robinson
- Book ID
- 125528354
- Publisher
- IEEE
- Year
- 2009
- Tongue
- English
- Weight
- 529 KB
- Volume
- 32
- Category
- Article
- ISSN
- 1521-3331
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