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A thermal study on moisture absorption by epoxy composites

✍ Scribed by G. Flor; G. Campari-Vigano'; R. Feduzi


Book ID
105397309
Publisher
Springer Netherlands
Year
1989
Tongue
English
Weight
426 KB
Volume
35
Category
Article
ISSN
0022-5215

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In the search for new packaging materials for the electrical/electronics industry, three types of polymer composites have been studied. Silicone/boron nitride powders, polyurethane/alumina powders, and polyurethane/carbon fibers have all been synthesized to study the moisture-absorption kinetics, th