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A technique for characterizing surface recombination in silicon wafers based on thermal-emission measurements

✍ Scribed by V. V. Bogatyrenko

Book ID: 111444588
Publisher: Springer
Year: 2010
Tongue: English
Weight: 166 KB
Volume: 44
Category: Article
ISSN: 1063-7826
DOI: 10.1134/s1063782610030206

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