✦ LIBER ✦
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates
✍ Scribed by Ho-Young Son; Gi-Jo Jung; Byung-Jin Park; Kyung-Wook Paik
- Book ID
- 107455226
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 947 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0361-5235
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