✦ LIBER ✦
A Study on Pore-forming Agent in the Resin Bond Diamond Wheel Used for Silicon Wafer Back-grinding
✍ Scribed by Kehua Li; Qiang Guo; Mingyao Liu; Yanjun Zhao; Dongli Shi
- Book ID
- 118492768
- Publisher
- Elsevier
- Year
- 2012
- Tongue
- English
- Weight
- 244 KB
- Volume
- 36
- Category
- Article
- ISSN
- 1877-7058
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