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A study of thermal stress and intrinsic residual stress in planar metallization for integrated power modules

✍ Scribed by Ning Zhu; van Wyk, J.D.; Zhenxian Liang; Odendaal, W.G.H.

Book ID: 117917240
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 756 KB
Volume: 41
Category: Article
ISSN: 0093-9994
DOI: 10.1109/tia.2005.858313

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