✦ LIBER ✦
A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits
✍ Scribed by E.H. Amalu; W.K. Lau; N.N. Ekere; R.S. Bhatti; S. Mallik; K.C. Otiaba; G. Takyi
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 1010 KB
- Volume
- 88
- Category
- Article
- ISSN
- 0167-9317
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