✦ LIBER ✦
A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board
✍ Scribed by E.S.W. Leung; W.K.C. Yung; W.B. Lee
- Publisher
- Springer
- Year
- 2004
- Tongue
- English
- Weight
- 747 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0268-3768
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