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A Study of Encapsulation Resin Containing Hexagonal Boron Nitride (hBN) as Inorganic Filler

✍ Scribed by Tzu Hsuan Chiang; T.-E. Hsieh

Book ID: 106416768
Publisher: Springer
Year: 2006
Tongue: English
Weight: 499 KB
Volume: 16
Category: Article
ISSN: 1053-0495
DOI: 10.1007/s10904-006-9037-8

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