✦ LIBER ✦
A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices
✍ Scribed by Takashi Onishi; Masao Mizuno; Takao Fujikawa; Tetsuya Yoshikawa; Jun Munemasa; Masataka Mizuno; Teruo Kihara; Hideki Araki; Yasuharu Shirai
- Book ID
- 107457177
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 640 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0361-5235
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