✦ LIBER ✦
A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging
✍ Scribed by D. C. Lin; R. Kovacevic; T. S. Srivatsan; G. X. Wang
- Book ID
- 107590115
- Publisher
- Indian Academy of Sciences
- Year
- 2008
- Tongue
- English
- Weight
- 301 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0256-2499
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