A stress-free packaging solution for planar waveguide-based photonic components

✍ Scribed by Zhiyi Zhang; Gao Zhi Xiao; Jiaren Liu

• Book ID: 119801899
• Publisher: IEEE
• Year: 2005
• Tongue: English
• Weight: 293 KB
• Volume: 17
• Category: Article
• ISSN: 1041-1135
• DOI: 10.1109/lpt.2005.845682