A static-sims study of thin nickel film on copper substrate
β Scribed by Fumitoshi Toyokawa; Nobuo Tago; Tadashi Kikuchi; Keiichi Furuya
- Publisher
- Elsevier Science
- Year
- 1983
- Weight
- 51 KB
- Volume
- 124
- Category
- Article
- ISSN
- 0167-2584
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π SIMILAR VOLUMES
A transmission electron microscopy study has been made of the growth of nickel films electrodeposited from a Watts bath at a cd of 1 mA/cms on to vapour-deposited (100) copper films. Average film thicknesses in the range 75-250 A have been studied both in position on the substrate and as separate s
The role of strain hardening for the deformation of thin Cu films was investigated quantitatively by conducting specialized tensile testing allowing the simultaneous characterization of the film stress and the dislocation density as a function of plastic strain. The stress-strain behavior was studie