A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
✍ Scribed by A. Voigt; M. Heinrich; K. Hauck; R. Mientus; G. Gruetzner; M. Töpper; O. Ehrmann
- Book ID
- 104050278
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 317 KB
- Volume
- 78-79
- Category
- Article
- ISSN
- 0167-9317
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✦ Synopsis
In this paper, we present the suitability of easy to handle negative tone photoresists providing examples of lift-off applications. The lithographic process of this single layer resist system requires standard broadband or i-line process conditions.
At first, the capability to obtain an undercut pattern and the thermal stability of the resist ma-N 1400 is demonstrated in the lift-off patterning of magnetron sputtered thin three layer contact system Ti/Pt/Au. Temperature of the substrate during sputtering was measured time-resolved using a thermal couple. Secondly, an example to achieve AuSn solder bumps of 7.5 lm diameter by a combination of sputtering and metal evaporation using the lift-off resist ma-N 400 is given. Regarding the further miniaturization of electronic devices, this process is a cost-effective method to achieve solder depots for flip chip bonding of ultra thin chips.