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A simple method for measuring the low temperature thermal conductivity in thin wires

โœ Scribed by G. Ventura; A. Bonetti; E. Gottardi; L. Lanzi; I. Peroni; A. Peruzzi; G. Ponti


Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
104 KB
Volume
38
Category
Article
ISSN
0011-2275

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โœฆ Synopsis


A new method is presented for measuring the low-temperature thermal conductivity of thin electrically-conducting samples. The proposed two-probe technique is useful mainly in the case of non free-standing samples of medium and high thermal resistivity. The method is simple: a resistance bridge is used both for measuring the temperatures and for heating the sample. The limits of this method are discussed. The thermal conductivities below 0.3 K of a normal alloy (manganin) and a superconducting alloy (Al/Si 1%), both which we obtained using this method, are presented.


๐Ÿ“œ SIMILAR VOLUMES


A simple method for producing high condu
โœ S.S. Rosenblum; W.A. Steyert; F.R. Fickett ๐Ÿ“‚ Article ๐Ÿ“… 1977 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 469 KB

We report here the details and results of a simple technique for treating polycrystalline copper which significantly reduces its low temperature electrical resistivity (and concomitantly the thermal resistivity). For polycrystalline copper, in the best cases one can obtain residual resistance ratios