In this paper, packaging effects, especially the packagecover influence, on the isolation of MMIC amplifiers are studied. Experiments and simulations are performed and compared. It is demonstrated that the compression approach is a suitable global electromagnetic (EM) simulation tool to analyse pack
A simple implementation of the compression approach for global EM analysis of microwave circuits
✍ Scribed by J. M. Lesage; R. Loison; R. Gillard; T. Barbier; Y. Mancuso
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 714 KB
- Volume
- 14
- Category
- Article
- ISSN
- 1096-4290
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✦ Synopsis
This article presents an original application of the compression approach that combines two commercial simulators. A numerical calibration procedure is proposed in order to improve the interfacing between the two simulation environments using internal ports. The capabilities of the proposed method are demonstrated by studying simple passive and active packaged structures.
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