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A Semiconductor-Nanowire Assembly of Ultrahigh Junction Density by the Langmuir–Blodgett Technique

✍ Scribed by S. Acharya; A. B. Panda; N. Belman; S. Efrima; Y. Golan


Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
551 KB
Volume
18
Category
Article
ISSN
0935-9648

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The colloidal particles of SiO 2 and TiO 2 were arranged in a twodimensional assembly on the solid substrate by using the Langmuir-Blodgett technique. The most favorable conditions for yielding uniform and dense packing of particles were examined. From scanning electron microscopy and atomic force m