✦ LIBER ✦
A Self-Consistent Substrate Thermal Profile Estimation Technique for Nanoscale ICs—Part I: Electrothermal Couplings and Full-Chip Package Thermal Model
✍ Scribed by Sheng-Chih Lin; Chrysler, G.; Mahajan, R.; De, V.K.; Banerjee, K.
- Book ID
- 114619008
- Publisher
- IEEE
- Year
- 2007
- Tongue
- English
- Weight
- 838 KB
- Volume
- 54
- Category
- Article
- ISSN
- 0018-9383
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