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A review of plastic packaging for hybrid thick-film circuits : W. L. Clough and J. M. Collins. Microelectronics3, No. 11 (1971), p. 4

Publisher: Elsevier Science
Year: 1972
Tongue: English
Weight: 215 KB
Volume: 11
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(72)90640-3

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