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A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network

✍ Scribed by Tzong-Yuan Juang; Jene-Ku Liu; Chia-Cheng Chang; Shi-Min Shau; Mei-Hui Tsai; Shenghong A. Dai; Wen-Chiung Su; Ching-Hsuan Lin; Ru-Jong Jeng


Book ID
106438804
Publisher
Springer
Year
2010
Tongue
English
Weight
300 KB
Volume
18
Category
Article
ISSN
1022-9760

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