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A ray-tracing model for multipath propagation prediction in picocellular environments

✍ Scribed by S. Y. Tan; T. W. Ang; H. S. Tan


Publisher
John Wiley and Sons
Year
2000
Tongue
English
Weight
126 KB
Volume
25
Category
Article
ISSN
0895-2477

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✦ Synopsis


Figure 6 Temperature distribution after heat balance devices andror circuits. In our work, the maximum temperature equals about 77ЊC, i.e., if the working temperature is limited to be lower than 77ЊC, the output power of each device cannot be greater than 8 W.

IV. CONCLUSIONS

The heat balance method is used to solve the three-dimensional heat transport equation to study the heat conduction effects of the MMIC package first. By using this method, it is convenient to deal with the boundary of the package. According to the result of the temperature after heat balance, the output power of the devices andror circuits can be limited when designing circuits in order to protect the packaged circuits from a high temperature.


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