So far there is no consensus on the fundamental mechanism of material removal in chemical-mechanical polishing (CMP). Some researchers model the CMP process based on the mechanism proposed by Kaufman et al. [1], who attribute the material removal from the wafer surface to chemistry-aided mechanical
A proposed mechanism for nonexponential chemical exchange
β Scribed by J.I Kaplan
- Publisher
- Elsevier Science
- Year
- 1991
- Weight
- 236 KB
- Volume
- 91
- Category
- Article
- ISSN
- 0022-2364
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A mechanism is proposed for the decomposition of strong-acid cation exchange resins. The five principal reactions of the decomposition mechanism are autoxidation, 1,2-hydroperoxide rearrangement with aromatic group migration, 1,2-hydroperoxide rearrangement with methylene group migration, Baeyer-Vil