✦ LIBER ✦
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding
✍ Scribed by Chun-Mei Li; Ping Yang; De-Ming Liu; Ngar-Chun Hung; Ming Li
- Book ID
- 107453858
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 464 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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