✦ LIBER ✦
A planar interconnection technology utilizing the selective deposition of tungsten-multilevel implementation
✍ Scribed by Thomas, D.C.; Wong, S.S.
- Book ID
- 114534556
- Publisher
- IEEE
- Year
- 1992
- Tongue
- English
- Weight
- 832 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0018-9383
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