✦ LIBER ✦
A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package
✍ Scribed by Nakazawa, T.; Inoue, Y.; Sawada, K.; Sudo, T.
- Book ID
- 114560572
- Publisher
- IEEE
- Year
- 1996
- Weight
- 999 KB
- Volume
- 19
- Category
- Article
- ISSN
- 1083-4400
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