✦ LIBER ✦
A novel multichip module assembly approach using gold ball flip-chip bonding : Cathryn E. Goodman and Michael P. Metroka. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 457 (1992)
- Publisher
- Elsevier Science
- Year
- 1993
- Tongue
- English
- Weight
- 112 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0026-2714
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